Jun 02, 2016 13:15 JST

Source: Hua Hong Semiconductor

Hua Hong Semiconductor Celebrates the 100,000th Wafers Shipment Milestone of Its Super Junction Process Platform

HONG KONG, Jun 02, 2016 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that the accumulated shipment of its Super Junction MOSFET (SJNFET) process platform crosses the 100,000th wafers mark, attributable to the strong market demand for SJNFETs. Through the collaboration with our customers in design optimization, system solutions and market penetration, the platform has recorded an increasing shipment since its mass production in 2011.

Development of green energy, one of the most distinct concepts proposed by China's 13th Five-Year Plan, will become a new engine for sustainable economic development. Popularity of green and efficient products will facilitate more extensive deployment of green energy technologies. Power discrete, at the core of SMPS (Switch-Mode Power Supply), motor drives, LED drivers, HEV/EV (hybrid/electrical vehicles) and smart grids, is the key to reduce power consumption and improve energy efficiency. Hua Hong Semiconductor's unique and competitive trench SJNFET process platform supports the manufacturing of products with voltage ranging from 500V to 900V. The advanced second-generation SJNFET technology achieved volume production and device performance has reached world-class standard. In addition, Hua Hong Semiconductor's second-generation optimized SJNFET technology enabling lower on-resistance and smaller cell pitch size is successfully developed and now open to customers.

Super Junction devices break the Si-limit of traditional MOSFET devices, realize lower specific on-resistance, higher breakdown voltage and higher switching frequency under the same packaging condition, and significantly improve the performance of power discrete. Compared with conventional Multi-epitaxial SJNFET technology, the trench structure delivers an array of distinct benefits such as fewer mask layers, simple device structure, better thermal performance, shorter manufacturing cycle and greater potential for performance improvement, etc.

Hua Hong Semiconductor, the first foundry that delivers the Super Junction process platform, doesn't rest on its laurels but constantly innovates to pursue lower on-resistance, higher switching frequency, lower switching loss, smaller chip size, robuster EAS capability and greater EMI protection. The Company plans to announce the new-generation SJNFET platform with more advanced performance to further consolidate its leadership in the power discrete field.

"Having been devoted to power discrete technology for more than 10 years, Hua Hong Semiconductor truly takes on its corporate responsibility to create 'China Chips', and the shipment of the 100,000th SJNFET wafers represents a major milestone in its journey." said Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor, "With the advent of the 'Green Era', power discrete will see a huge market potential in the new application areas of consumer electronics, industrial and automotive. Hua Hong Semiconductor's unique SJNFET technology will benefit from the increasing demand of high-voltage semiconductor solutions. Thus, we are expanding production capacity for Super Junction products to cater the increasing customer demands."


Source: Hua Hong Semiconductor
Sectors: Electronics, Daily Finance, Daily News

Copyright ©2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.

Related Press Release


Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
June 03 2021 12:30 JST
 
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions
August 27 2020 13:00 JST
 
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT Market
July 31 2020 12:28 JST
 
Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform
July 20 2020 12:50 JST
 
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production
June 27 2019 12:15 JST
 
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced
October 10 2018 19:00 JST
 
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
June 14 2018 09:36 JST
 
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
May 08 2018 16:26 JST
 
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
December 27 2017 17:17 JST
 
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms
December 15 2017 14:40 JST
 
More Press release >>

Latest Press Release


More Latest Release >>