May 15, 2024 14:30 JST

Source: Honda Motor Co, Ltd

Honda and IBM sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity

TOKYO, Japan / ARMONK, N.Y., U.S.A., May 15, 2024 - (JCN Newswire) - Honda Motor Co., Ltd. (Honda) today announced that Honda and IBM have signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies(1) needed to overcome challenges related to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.

The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs. Honda and IBM anticipate that SDVs will dramatically increase the design complexity, processing performance, and corresponding power consumption of semiconductors compared to conventional mobility products. In order to solve anticipated challenges and realize highly-competitive SDVs, it is critical to develop capabilities in the independent research and development of next-generation computing technologies. Based on this understanding, the two companies began considering long-term joint research and development opportunities.

In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing(2) and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions. 

Through this collaboration, the two companies would strive to realize SDVs that feature the world’s top-level computing and power saving performance.

(1) Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
(2) Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.

Source: Honda Motor Co, Ltd
Sectors: Electronics, Automotive, EVs, Transportation

Copyright ©2025 JCN Newswire. All rights reserved. A division of Japan Corporate News Network.

Related Press Release


Honda Announces New Electric Motorcycle "Honda WN7" in Europe
September 17 2025 16:46 JST
 
Honda Develops New "Chemical Sorting" Technology to Separate Solid Contaminants from Waste Plastics Derived from End-of-life Automobiles
September 16 2025 14:00 JST
 
The 46th Honda Prize 2025 Awarded to Dr. Kenichi IGA
September 09 2025 18:06 JST
 
Toni Bou Wins 19th Consecutive FIM Trial World Championship Title
September 08 2025 17:53 JST
 
Honda to Commercialize UNI-ONE Hands-Free Personal Mobility Device
September 08 2025 14:56 JST
 
Honda to Begin Sales of All-new Prelude
September 04 2025 12:20 JST
 
Honda Premieres a New Color Option for Four Large-size Outboard Motors at HISWA In-Water Boat Show 2025 in the Netherlands
September 03 2025 22:50 JST
 
Honda Running Team Member, Nagiya Mori, Selected to Represent Japan in World Athletics Championships Tokyo 25 (WCH Tokyo 25) Men's 5000m Event
September 03 2025 11:30 JST
 
Honda to Provide Official Vehicles for World Athletics Championships Tokyo 25 as Official Global Partner
September 01 2025 12:50 JST
 
Honda Announces New Plan for Relocation of Global Head Office to Yaesu Area in Tokyo and Reconstruction of Honda Aoyama Building
August 29 2025 17:54 JST
 
More Press release >>

Latest Press Release


More Latest Release >>