May 15, 2024 14:30 JST

Source: Honda Motor Co, Ltd

Honda and IBM sign Memorandum of Understanding to Explore Long-term Joint Research and Development of Semiconductor Chip and Software Technologies for Future Software-Defined Vehicles
Agreement outlines intent to research and develop solutions to new challenges related to processing performance, power consumption, and design complexity

TOKYO, Japan / ARMONK, N.Y., U.S.A., May 15, 2024 - (JCN Newswire) - Honda Motor Co., Ltd. (Honda) today announced that Honda and IBM have signed a Memorandum of Understanding (MOU) outlining their intent to collaborate on the long-term joint research and development of next-generation computing technologies(1) needed to overcome challenges related to processing capability, power consumption, and design complexity for the realization of the software-defined vehicles (SDV) of the future.

The application of intelligence/AI technologies is expected to accelerate widely in 2030 and beyond, creating new opportunities for the development of SDVs. Honda and IBM anticipate that SDVs will dramatically increase the design complexity, processing performance, and corresponding power consumption of semiconductors compared to conventional mobility products. In order to solve anticipated challenges and realize highly-competitive SDVs, it is critical to develop capabilities in the independent research and development of next-generation computing technologies. Based on this understanding, the two companies began considering long-term joint research and development opportunities.

In particular, the MOU outlines areas of potential joint research of specialized semiconductor technologies such as brain-inspired computing(2) and chiplet technologies, with the aim to dramatically improve processing performance while, simultaneously, decreasing power consumption. Hardware and software co-optimization is important to ensure high performance and fast time to market. To achieve such benefits and manage design complexity for future SDVs, the two companies also plan to explore open and flexible software solutions. 

Through this collaboration, the two companies would strive to realize SDVs that feature the world’s top-level computing and power saving performance.

(1) Computing technology being developed with an aim to achieve both high processing performance and low power consumption in the 2030s and beyond.
(2) Computer architecture and algorithms that mimic the brain's structure and function while optimizing for silicon.

Source: Honda Motor Co, Ltd
Sectors: Electronics, Automotive, EVs, Transportation

Copyright ©2025 JCN Newswire. All rights reserved. A division of Japan Corporate News Network.

Related Press Release


Six Companies Establish BlueRebirth Council to Expand Use of Recycled Materials in New Vehicles
June 30 2025 18:25 JST
 
Honda Changes Plan to Build New Production Plant for Next-generation Fuel Cell Module in Japan
June 30 2025 18:20 JST
 
Honda Opens "Honda Software Studio Osaka" as New Software Development Operation
June 26 2025 12:30 JST
 
Honda Issues "Honda ESG Report 2025"
June 26 2025 12:29 JST
 
Honda Celebrates 60th Anniversary of First F1 Victory with Special Events Program
June 17 2025 16:45 JST
 
Honda Teams to Compete in 2025 FIM Endurance World Championship "Coca-Cola" Suzuka 8 Hours Endurance Road Race 46th Tournament
June 16 2025 15:37 JST
 
Honda to Co-develop Refueling Port Connecting System for On-orbit Satellite Refueling with Astroscale
May 30 2025 10:54 JST
 
Honda Expands Production Capacity by Adding New Production Line at Fourth Motorcycle Plant in India
May 23 2025 11:17 JST
 
Honda Reaches 500 Million-Unit Milestone in Cumulative Global Motorcycle Production
May 23 2025 10:32 JST
 
Honda and Quemix Co-develop a New, World's First Quantum State Readout Technology
May 15 2025 12:37 JST
 
More Press release >>

Latest Press Release


More Latest Release >>