ENGLISH
|
JAPANESE
|
CONNECT WITH US:
Home
About
Contact
Log in
*
Home
Press release
Mar 30, 2016 13:08 JST
Source:
Hua Hong Semiconductor
Hua Hong Semiconductor Reports Record-High Shipment of Java Smart Card Chips in 2015
HONG KONG, Mar 30, 2016 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced that shipment of its Java smart card chips exceeded 720 million in 2015, a year-on-year increase of 27 percent compared with 565 million in 2014. This significant increase and record-high shipment is attributed to massive deployment of Java IC cards featuring high security, compatibility and scalability in mobile telecom applications and increasing recognition of the technology from multiple well-known local and international fabless chip design houses in the industry.
Hua Hong Semiconductors' 0.13um and 0.11um embedded non-volatile memory (eNVM) technology offer high reliability and 100 years of data retention with up to 300,000 times of endurance. Besides, the Company is striving to provide customers with higher performance-price solutions with smaller die size and lower mask layers while ensuring high reliability. This includes the ongoing development of the 90nm eNVM process that enables fabrication of smaller-size dies and delivers the benefits of leading technology and competitiveness to customers.
Mr. Fan Heng, Executive Vice President of Hua Hong Semiconductor said: "Leveraging our proven track record and expertise in eNVM platform, Hua Hong Semiconductor not only empowers customers' progress and enables high reliability, performance and cost-effectiveness of their products, but also achieves outstanding performance and demonstrates exceptional competitiveness in the IC card chip markets."
Source: Hua Hong Semiconductor
Sectors: Electronics, Daily News
Copyright ©2026 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.
Latest Release
Fujitsu provides core business system for real-time information management of all Japan Maritime Self-Defense Force supplies
May 26, 2026 19:20 JST
Fujitsu's groundbreaking computing technology for accelerating scientific computing wins the Prime Minister's Prize in Japan
May 26, 2026 13:50 JST
NTT, Kubota and NTT DOCOMO Demonstrate Communication Technologies Enabling Remote Operation of Robotic Agricultural Machinery in Mountainous Areas
May 26, 2026 13:30 JST
Successful Demonstration of Stable, High-Capacity mmWave Communications for Multiple High-Speed Vehicles for the 6G Era
May 25, 2026 14:58 JST
Fujitsu develops self-evolving multi-AI agent technology that learns and adapts to business operations
May 25, 2026 14:13 JST
Eisai Deepens Body of Clinical Evidence for LENVIMA(R) (Lenvatinib) Across Established Indications at ASCO 2026
May 22, 2026 00:23 JST
Honda to Begin Sales of Super-ONE Compact EV
May 22, 2026 00:16 JST
Fujitsu supports the Panasonic Group in accelerating its sustainability management through the implementation of a CFP calculation solution
May 21, 2026 13:57 JST
Sharp Launches Poketomo Conversational AI Character in Taiwan
May 21, 2026 13:55 JST
Hitachi Energy's HMAX Energy service solutions strengthen long-term reliability for Akaysha Energy's Ulinda Park BESS
May 21, 2026 13:40 JST
Heads of State/Government, Ministers, and Senior Officials from 30 Countries to Convene in Tokyo for the Island States Ocean Summit
May 20, 2026 17:00 JST
Trusco Nakayama and Fujitsu accelerate personnel transfer decision-making process with data and AI
May 20, 2026 13:50 JST
Hitachi announces strategic partnership with Anthropic to strengthen "Lumada 3.0" through frontier AI
May 19, 2026 23:09 JST
SMBC Group, Fujitsu and SoftBank agree on alliance to build Japan-made platform for sustainable healthcare
May 19, 2026 13:37 JST
Ashikaga Bank launches Fujitsu's service supporting digitalization of Inheritance Procedure
May 18, 2026 18:13 JST
Sharp to Exhibit at The 3rd SPEXA - Space Business Expo
May 18, 2026 17:34 JST
MHIEC Receives Waste Treatment Technology Verification Report from JESC for Its Fluidized Bed-type Gasification and Reforming System
May 18, 2026 17:17 JST
MHI Thermal Systems Receives A' Design Awards
-- Recognition at Italy's International Design Competition for the Hydrolution EZY Series of Air-to-Water Heat Pumps and the ZT Series of Residential-Use Air-Conditioners --
May 18, 2026 16:26 JST
Tallgrass and Mitsubishi Power Americas Announce Turbine Allocation for Cheyenne Power Hub
May 18, 2026 15:15 JST
JCB and Wonder Advance Cashless Taxi Payments in Hong Kong
May 18, 2026 10:00 JST
More Latest Release >>
Related Release
Hua Hong Semiconductor Achieved Mass Production of 12'' 90nm BCD
June 03 2021 12:30 JST
Hua Hong Semiconductor Launches 90nm Ultra-Low-Leakage Embedded Flash Process Platform to Power High-Capacity MCU Solutions
August 27 2020 13:00 JST
Hua Hong Semiconductor Relies on '8-inch + 12-inch' Strategy to Accelerate Development in IGBT Market
July 31 2020 12:28 JST
Hua Hong Semiconductor Continues to Build a Superior eNVM Process Platform
July 20 2020 12:50 JST
Hua Hong Semiconductor 3rd-Generation 90nm eFlash Process Platform Achieves Mass Production
June 27 2019 12:15 JST
Hua Hong Semiconductor Second Generation 0.18um 5V/40V BCD Process Platform Successfully Mass Produced
October 10 2018 19:00 JST
The Analog IP Portfolio Enables Hua Hong Semiconductor to Focus on the Development of MCU Market
June 14 2018 09:36 JST
Hua Hong Semiconductor Redoubled Shipment of Financial IC Card Chips to Over 400 Million in 2017
May 08 2018 16:26 JST
Hua Hong Semiconductor's 90nm G2 eFlash Process Platform Successfully Achieved Mass Production
December 27 2017 17:17 JST
Hua Hong Semiconductor introduces 12-bit SAR ADC IP to enable Ultra-Low Power MCU Platforms
December 15 2017 14:40 JST
More Press release >>