TOKYO, Mar 5, 2026 - (JCN Newswire) - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head Office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced the successful development of “HPM-L111”, the world’s first metal^*1 palladium (Pd) hydrogen permeable membrane capable of delivering high hydrogen permeation performance at low temperature range around 100°C. The breakthrough enables high-purity and fast hydrogen purification at significantly lower temperatures than previously possible, reducing energy consumption and supporting next-generation hydrogen ecosystem development across global markets.

Sample shipments of HPM-L111 is scheduled to begin on or after March 5, 2026, with production capacity of approximately 100 samples per month.

An academic presentation regarding this product will be made at The Japan Institute of Metals and Materials’ “2026 Spring Meeting,” which will be held at Chiba Institute of Technology from March 11 to 13, 2026. The product and a panel display will also be showcased at “H2 & FC EXPO Int’l Hydrogen & Fuel Cell Expo” being held at Tokyo Big Sight from March 17 to 19, 2026.

A palladium hydrogen permeable membrane is a thin membrane product made from palladium alloy, which has the properties of hydrogen absorption and permeation. It is widely used for the separation and purification of high-purity hydrogen. Traditionally, metal membranes require high temperatures (at least 300°C) to achieve effective hydrogen permeation. By applying special treatment to the membrane’s surface, TANAKA succeeded in developing a metal membrane that can demonstrate high hydrogen permeation performance even at a low temperature range at or below 100°C.

Issues in hydrogen purification using metal membranes and background to the development of HPM-L111

Among PdCu alloy membranes, the existing product PdCu40 (an alloy with 60% palladium content and 40% copper content) has the highest level of hydrogen permeation performance. However, operation at a high temperature range of around 400°C is required to achieve its true performance, and higher costs from the addition of heating facilities and such were an issue for many years. Furthermore, with the advancement of hydrogen-related technologies in recent years, there are increasing need for hydrogen permeation using metal membranes in the low temperature range of 100°C or lower. Meanwhile, the speed of hydrogen penetration from the surface into metal membranes generally decreases when the temperature is 200°C or lower, significantly reducing the hydrogen permeation performance of conventional metal membranes and making practical application an issue.

To solve these issues, for HPM-L111, TANAKA adopted its proprietary surface treatment technology nurtured through many years of precious metal materials research. Minute jagged structures were formed on the membrane’s surface to increase the specific surface area, resulting in a higher hydrogen penetration speed and achieving significant improvement in hydrogen permeation performance in the low temperature range of 100°C or lower.

Features of HPM-L111

• High hydrogen permeation performance in the low temperature range around 100°C
• World’s first metal membrane allowing high-purity hydrogen purification in the low temperature range around 100°C
• Expected contributions to higher accuracy of hydrogen sensors
• Allows high-speed removal of hydrogen generated within devices

Expected applications of high-purity hydrogen permeation in the low temperature range, or 100°C or lower, include hydrogen sensors, fuel cells, and removal of hydrogen in vacuum equipment. In hydrogen sensors, it can help to improve detection accuracy by isolating interfering gases, while in vacuum equipment and such, it allows hydrogen to be removed from inside the equipment while maintaining an operating environment close to room temperature or a low temperature range. Furthermore, it can contribute toward the realization of carbon neutrality by reducing the energy for heating, as the heating process to at least 300°C—which was previously required—is no longer necessary. TANAKA will support the realization of a clean and efficient hydrogen society through the provision of this product.

^*1 As of March 5, 2026, based on internal research (according to a survey of patents and papers on hydrogen permeable membranes)

About TANAKA

Since its foundation in 1885, TANAKA has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volume of precious metals it handles. Over many years, TANAKA has manufactured and sold precious metal products for industry and provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and worldwide collaborate on manufacturing, sales, and technology development to offer a full range of products and services. With 5,591 employees, the group’s consolidated net sales for the fiscal year ended December 2024 were 846.9 billion yen.

TANAKA Industrial Precious Metal Materials Portal
https://tanaka-preciousmetals.com

Product inquiries
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/

Press inquiries
TANAKA PRECIOUS METAL GROUP Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-for-media/

Press Release: https://www.acnnewswire.com/docs/files/2026305_EN.pdf 

TOKYO, Mar 3, 2026 - (JCN Newswire) - TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. (Head office: Chuo-ku, Tokyo; Representative Director & CEO: Koichiro Tanaka), a company engaged in the industrial precious metals business of TANAKA, today announced a gold bump^*1 transfer technology for the sintered gold (Au) bonding technology, AuRoFUSE™ Preforms. This technology allows AuRoFUSE™ Preforms (gold bumps) to be formed even on semiconductor chips and substrates^*2 with complex structures.

Advantages of being able to transfer gold bumps

In this technology, at first, gold bumps are formed on a substrate (transfer substrate). Then, the gold bumps are transferred to the target semiconductor chip or substrate. Openings are created on the silicon substrate used as the transfer substrate, and gold bumps are formed in them. By filling the entire opening, the gold bump is held by the substrate, eliminating the risk of dropping during the process. Meanwhile, during transfer, the gold bump shrinks under heat-treatment, forming a tiny gap between the opening and the gold bump. This allows easy extraction of gold bumps by the application of a force in the vertical direction.

As the traditional gold bump formation process is a method that directly forms bumps on the target semiconductor chip or substrate, it is difficult to handle target chips and substrates with complex shapes, such as protrusions, dents, or open holes due to issues such as inconsistent resist heights.

In this current transfer technology, gold bumps are manufactured separately and can be transferred only to the target locations. This allows the technology to also be applied to complex shapes. It can also be used with semiconductor chips and substrates that are difficult to process using photolithography^*3 due to concerns about damage from stripping solutions and others.

Manufacturing of transfer substrate and transfer and bonding process

(1) Preparation of silicon substrate as transfer substrate
(2) Application of photoresist to silicon substrate
(3) Exposure and development of target pattern
(4) Etching of silicon substrate to create holes
(5) Application of AuRoFUSE™ using a squeegee, etc.
(6) Vacuum drying of AuRoFUSE™ at room temperature and scraping off excess gold particles on the resist
(7) Removal of resist to complete transfer substrate
(8) Placement of transfer substrate on target (semiconductor chip or substrate) for gold bump formation, thermocompression at 10 MPa and 150℃ for one minute, followed by vertical lifting of substrate to transfer gold bumps
(9) Bonding of post-transfer target through thermocompression at 20 MPa and 200℃ for 10 seconds

An illustration of the traditional gold bump formation process is available in the “Manufacturing of AuRoFUSE™ Preforms” section for reference on TANAKA’s website.

About the sintered gold bonding technology “AuRoFUSE™ Preforms”

Developed by TANAKA, “AuRoFUSE™ Preforms” is a bonding technology that forms bumps of all kinds of shapes using a paste comprising gold particles and an organic solvent. Through a thermocompression bonding process (20 MPa at 200℃ for 10 seconds), AuRoFUSE™ Preforms exhibits compression of approximately 10% in the compressive direction while showing minimal deformation in the horizontal direction. This gives them sufficient bonding strength^*4 for practical applications. With the main component being gold, which has a high level of chemical stability, AuRoFUSE™ Preforms also provides excellent reliability after mounting.

This technology enables miniaturization of semiconductor wiring and greater integration (higher density) for various types of chips. It is expected to contribute to the needs for miniaturization and better performance of semiconductors, which have been rising in recent years, including optical devices such as light-emitting diodes (LEDs) and semiconductor lasers (LDs), use in digital devices such as personal computers, smartphones, as well as in-vehicle components, micro-electromechanical systems (MEMS), and such.

Traditionally, the main methods used in bump formation technology are soldering and plating. However, as solder tends to spread outward in molten state, there was the risk of short-circuiting through contact between electrodes as the bump pitch becomes finer. Meanwhile, plating can achieve a fine pitch, but because comparatively higher pressures are required during bonding, there is the possibility of causing chip damage. For reference, an illustration outlining the advantages of this technology compared with soldering and plating materials is provided in the “Comparison of AuRoFUSE™ Preforms with Other Materials” section on TANAKA’s website. This technology was developed to address these issues for use in next-generation high-density mounting and photonics-electronics integration devices.

AuRoFUSE™ and TANAKA’s gold materials

AuRoFUSE™ is a paste-type bonding material containing a mixture of gold particles, with the particle diameter controlled to be submicron sized, and an organic solvent. Compared to the melting point of gold (approximately 1,064℃), bonding is possible at a low temperature of approximately 200℃.

Gold is a material with low electrical resistance and extremely high thermal conductivity. Therefore, in power semiconductors that handle large currents and high-density chips that dissipate a lot of heat, it can efficiently dissipate heat and limit energy loss. Among precious metals, it is also particularly resistant to oxidation and has stable properties, making it less susceptible to corrosion after mounting and ion migration (a phenomenon in which metals move and cause short circuits). This allows it to maintain high reliability over long periods of time.

TANAKA is highly skilled in precious metal material development technologies, developed since its establishment. It has used these technologies to undertake development of precious metal materials, such as gold, which plays a key role in the semiconductor field. With a system that integrates the entire chain of processes, from raw material procurement to material development, manufacturing, and recycling, TANAKA will contribute to the development of semiconductor technologies and the realization of a sustainable society while effectively using limited precious metal resources.

^*1 Bumps: Protruding electrodes
^*2 Substrate: Board that electrically and mechanically supports semiconductor chips mounted on it
^*3 Photolithography: Technology for forming fine circuit patterns on substrates
^*4 Bonding: Refers to shear strength (strength determined through application of a lateral load during testing)

About TANAKA

Since its foundation in 1885, TANAKA has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volume of precious metals it handles. Over many years, TANAKA has manufactured and sold precious metal products for industry and provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and worldwide collaborate on manufacturing, sales, and technology development to offer a full range of products and services. With 5,591 employees, the group’s consolidated net sales for the fiscal year ended December 2024 were 846.9 billion yen.

TANAKA Industrial Precious Metal Materials Portal
https://tanaka-preciousmetals.com

Product inquiries
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-on-industrial-products/

Press inquiries
TANAKA PRECIOUS METAL GROUP Co., Ltd.
https://tanaka-preciousmetals.com/en/inquiries-for-media/

Press Release: https://www.acnnewswire.com/docs/files/20260303_EN.pdf 

TOKYO, Feb 26, 2026 - (JCN Newswire) - Mitomo Semicon Engineering Co., Ltd., a subsidiary of EEJA Ltd. (Head office: Chuo-ku, Tokyo; CEO: Akihiko Domae), which operates TANAKA’s plating business, announces that it will change its company name effective April 1, 2026, as outlined below.

Details of the company name change
Current name: Mitomo Semicon Engineering Co., Ltd.
New name: EEJA Technologies Ltd.

Mitomo Semicon Engineering is engaged in the design, manufacture, and sale of plating equipment for semiconductors and electronic components. With this company name change, the company will further strengthen collaboration with EEJA, which provides plating chemicals and processes, and will offer enhanced value to customers through total solutions that integrate plating chemicals, equipment, and process design.

Company name: Mitomo Semicon Engineering Co., Ltd.
(New company name: EEJA Technologies Ltd.)

Company name: EEJA Ltd.

Company name: TANAKA PRECIOUS METAL GROUP Co., Ltd.

About TANAKA

Since its foundation in 1885, TANAKA has built a portfolio of products to support a diversified range of business uses focused on precious metals. TANAKA is a leader in Japan regarding the volume of precious metals it handles. Over many years, TANAKA has manufactured and sold precious metal products for industry and provided precious metals in such forms as jewelry and assets. As precious metals specialists, all Group companies in Japan and worldwide collaborate on manufacturing, sales, and technology development to offer a full range of products and services. With 5,591 employees, the group’s consolidated net sales for the fiscal year ended December 2024 were 846.9 billion yen.

TANAKA PRECIOUS METAL GROUP Co., Ltd.
TANAKA Corporate Website
https://www.tanaka.co.jp/english/

Press inquiries
TANAKA PRECIOUS METAL GROUP Co., Ltd.
https://www.tanaka.co.jp/support/req/other_contact_e/index.html

Press Release: https://www.acnnewswire.com/docs/files/20260226_EN.pdf 

TOKYO, Japan, Feb 4, 2026 - (JCN Newswire) - Honda Motor Co., Ltd. (Honda) today announced plans to co-develop system-on-a-chip (SoC) for its software-defined vehicles (SDVs), with Mythic, a Texas, U.S.-based technology company.

Honda has invested in Mythic, which has original technologies and a proven track record in this field of technologies, to establish technologies to enhance the computing performance and energy efficiency of AI to be used for automated driving and other features of its SDVs. Today, Honda announced plans for Honda R&D Co., Ltd., the R&D subsidiary of Honda, to co-develop automobile SoC with Mythic.

In order to continue offering the “joy and freedom of mobility” in a sustainable manner, Honda has been placing the highest priority on addressing environmental and safety challenges. In particular, enhanced application of intelligent technology will be the key to addressing safety issues. This makes the advancement of high-performance SoC for SDVs essential; therefore, Honda is conducting research and development of digital computing*1 technologies.

Looking ahead, as AI technologies continue to advance, further innovation is required in technologies to enhance computing performance and energy efficiency. With a view to building computing infrastructures which will contribute to the application of next-generation intelligent technologies, Honda is actively exploring neuromorphic*2 SoC technology, that draws inspiration from how the human brain works.

Mythic is a startup company with strong expertise in semiconductor technologies that leverage analog computing, which achieves high-efficiency AI processing with low power consumption. For the development of neuromorphic SoC, Mythic has original analog compute-in-memory (CiM)*3 technology and a proven track record in software implementation using tools such as software development kit (SDK)*4. With its analog CiM, Mythic is working to minimize data movement for computation and achieve both high computing performance and energy efficiency.

Honda has invested in Mythic to pay close attention to original technologies of Mythic and respond flexibly to future changes in the technological environment and societal trends. Moreover, Honda R&D will leverage its expertise and technologies amassed through the design of its original AI models and the research and development of electronic control units and integrate the original technology of Mythic into AI computing functions that consist of SoC. With that, Honda R&D will further accelerate the research and development of SoC for next-generation SDVs, to further enhance computing performance and energy efficiency.

About Mythic

- Head office location: Austin, Texas, U.S.A.
- Business: Development and sales of neuromorphic NPU*5 for edge computing*6
- Representative: Taner Ozcelik, CEO
- Establishment: 2012

*1 A computing method that repeats computations and data transfers between the processor and memory.
*2 A technology that mimics the structure and function of neurons and synapses and integrates computation and memory to eliminate delays in data transfers between the CPU and memory, aiming to enhance computing performance and energy efficiency.
*3 A technology that integrates memory and computing units, performing computation directly within memory to significantly reduce power consumption associated with data movement.
*4 A development kit that bundles the libraries and tools necessary to develop applications for a specific OS or platform.
*5 Neural Processing Unit (NPU): A computing device specialized for AI inference, capable of parallel processing of neural networks.
*6 A technology that places data processing infrastructure at or near the devices where data is generated (edge) to process data with minimal latency.

TOKYO, Jan 28, 2026 - (JCN Newswire) - NEC Corporation (NEC; TSE: 6701) today announced the development of a high-efficiency, compact Power Amplifier Module (PAM) for the sub-6GHz band, designed for integration into 5G base station Radio Units (RUs).

PAMs are electronic components that amplify signals for long-distance radio transmission, and their power consumption accounts for approximately 75% of the total power consumed by an RU (*1). By integrating this high-efficiency PAM into RUs, NEC aims to reduce device power consumption and size, thereby contributing to overall power savings in 5G networks and reduced operational costs for telecommunication carriers.

NEC plans to incorporate this PAM into new RUs scheduled for release in the first half of fiscal year 2026 (*2) and also envisions a global deployment of the PAM as a standalone product, including its application in base stations from other manufacturers.

New Power Amplifier Module for 5G Base Station
Radio Units (Front/Back)

This PAM achieves both high efficiency and compactness, which has been challenging until now, by integrating NEC's strengths in high-efficiency circuit design technology using Gallium Nitride (GaN) devices, high-density mounting technology, and simulation expertise related to load modulation methods. Specifically, it achieves a high Power-Added Efficiency (PAE) of 50%, indicating the proportion of supplied DC power that can be used for amplifying radio signals. This results in a 10% reduction in power consumption compared to conventional PAMs (*3). Furthermore, it boasts a compact form factor of 10mm x 6mm.

Since 5G networks utilize higher frequency bands compared to 4G, the coverage area of a single RU is relatively narrower. Therefore, to ensure comprehensive coverage across wide areas and even behind buildings, more RUs need to be deployed. By integrating this PAM into RUs, NEC aims to reduce the power consumption of individual RUs, contributing to overall power savings in 5G networks and lowering operational costs for telecommunication carriers.

NEC will showcase this PAM at "MWC Barcelona 2026 (MWC2026)," the world's largest mobile-related exhibition, scheduled from March 2 to 5, 2026. At the venue, NEC will highlight the PAM's features, high-efficiency operation, energy-saving effects, and increased design flexibility for equipment.

Going forward, NEC will continue to provide technologies that balance energy efficiency and high performance to realize sustainable network infrastructure.

Some of the technologies used in the new device were obtained from a grant program (JPJ012368G50801) by the National Institute of Information and Communications Technology (NICT), Japan.

(*1) According to NEC research (as of January 28, 2026)
(*2) Press release: NEC Develops New 5G Base Station Radio Unit for Enhanced Communication Throughput, Compactness, and Energy Efficiency
https://www.nec.com/en/press/202601/global_20260123_01.html
(*3) According to NEC research (as of January 28, 2026)

About NEC

The NEC Group leverages technology to create social value and promote a more sustainable world where everyone has the chance to reach their full potential. NEC Corporation was established in 1899. Today, the NEC Group’s approximately 110,000 employees utilize world-leading AI, security, and communications technologies to solve the most pressing needs of customers and society.

For more information, please visit https://www.nec.com, and follow us on LinkedIn and YouTube. 

TOKYO, Jan 7, 2026 - (JCN Newswire) – Hitachi High-Tech Corporation ("Hitachi High-Tech", part of Hitachi, Ltd.’s Connective Industries Sector), launches the FOUNDRY-MASTER Smart 2, an enhanced stationary optical emission spectrometer ("OES") designed to deliver lab-grade precision in a compact, durable format designed specifically for Quality Assurance/Quality Control (QA/QC) and non-ferrous metal analysis. The instrument is manufactured by Hitachi High-Tech Analytical Science GmbH and sold worldwide by its group company, Hitachi High-Tech Analytical Science Ltd. ("Hitachi High-Tech Analytical Science").

The FOUNDRY-MASTER Smart 2

Hitachi High-Tech provides analytical instruments as a digitalized asset that serves as the basis for providing advanced digital services using Lumada. With thousands of units installed globally over the past decade, our first-generation FOUNDRY-MASTER Smart earned a reputation for reliability in demanding industrial environments such as aluminum, non-ferrous metal foundries, metal fabrication, and recycling. This next-generation release continues that legacy, combining familiar dependability with modernized performance.

Building on this foundation, the FOUNDRY-MASTER Smart 2 introduces a series of targeted upgrades that improve analytical performance, enhance stability, and reduce long-term maintenance - all without increasing the price.

Hitachi, Ltd.’s Connective Industries Sector ("CI Sector"), to which Hitachi High-Tech belongs, is working to provide "HMAX Industry" which combines data from an abundant install base of products (Digitalized Assets), domain knowledge, and advanced AI. Through FOUNDRY-MASTER Smart 2 as a digitalized asset that acquires and generates data, Hitachi High-Tech as part of the CI Sector will focus on "Integrated Industry Automation" which aims to expand "HMAX Industry," a next-generation solutions for industrial field that embodies Lumada 3.0, into growth industries horizontally, including research in the healthcare field and materials, and contributing to innovation for frontline workers.

Main features

OES can quickly analyze the composition and quantity of solid metals with minimal preparation. Compact stationary OES instruments are designed to fit seamlessly into the onsite laboratories of foundries, manufacturing sites and recycling sites, enabling rapid and reliable metal analysis. Improvements have been made, primarily to include a scientific CMOS sensor, to provide a more accurate and user-friendly analytical environment.

1. Technology advancements

Among the key upgrades is a scientific CMOS(*1) sensor, typically found in high-end laboratory instruments. This sensor is complemented by the ultra-stable spark source(*2), previously exclusive to flagship models. Together, they deliver tighter detection limits and consistent, repeatable results, especially for critical elements in aluminum, zinc, and lead alloys that control strength, corrosion resistance, and compliance. The CMOS sensor captures faint emission lines with less background noise, while the stable spark source ensures identical excitation conditions from measurement to measurement. This reduces signal variation and makes low-level results more reliable.

(*1) CMOS (Complementary Metal Oxide Semiconductor) sensor. A highly sensitive detector that captures even very faint light signals, improving accuracy for trace elements.
(*2) ultra-stable spark source ensures identical excitation conditions from measurement to measurement.

Supporting these advancements is an optimized readout design that minimizes EMI(*3), ensuring signal clarity and stability even in noisy industrial environments. By cutting interference and drift by EMI, the system maintains calibration and performance over time, increasing confidence in every result.

(*3) EMI (electromagnetic interference) - unwanted electrical noise from surrounding equipment that can distort signals

2. Built for industrial realities

The FOUNDRY-MASTER Smart 2 is designed for the practical demands of metal analysis in QA/QC and foundry settings. Its existing compact benchtop footprint continues to save space, while the updated housing introduces a more modern look and improves component integration, making routine access and servicing easier. Combined with our intuitive SpArcfire software, it is easy to operate, even for non-specialist users, making it a dependable tool for fast, accurate results.

3. Application-driven support

Backed by Hitachi High-Tech Analytical Science’s application-driven support, operators benefit from expert guidance, custom calibrations, and hands-on training to ensure seamless integration into routines. With a broad global installation base and a track record of responsive service, Hitachi High-Tech continues to be a reliable partner in stationary OES.

“We have focused this update on the things our customers rely on most: dependable performance, a compact footprint, and strong value for money,” said Michael Molderings, Product Manager OES at Hitachi High-Tech Analytical Science “It’s a practical evolution of a trusted system, built to support everyday QA/QC and foundry workflows.”

Website for FOUNDRY-MASTER Smart 2

https://hha.hitachi-hightech.com/foundry-master-smart-2

About Hitachi High-Tech Analytical Science

As part of the Hitachi High-Tech Group, Hitachi High-Tech Analytical Science specializes in a wide range of connected materials analysis products and services for use in the lab or in-field around the world. We operate globally with centers worldwide offering assembly, sales and support services to customers across Asia, America and EMEA. For more information, and to view our range of solutions please visit: https://hha.hitachi-hightech.com

About Hitachi High-Tech 

Hitachi High-Tech provides cutting-edge technologies, products and services to society and customers with it scorporate vision of "Changing the World and Future with the Power of Knowledge" to contribute to a sustainable global environment, healthy, safe and secure lives, and the sustained development of science and industry. We manufacture and sell clinical analyzers, biotechnology products and radiation therapy systems in the healthcare field, semiconductor manufacturing and inspection equipment in the semiconductor field, as well as analytical systems and electron microscopes used in environmental fields and materials research. We are also engaged in a wide range of business areas globally, providing high added-value solutions in battery, communication infrastructure, railway inspection, digital and other industrial and social infrastructure fields. We provide solutions through a deeper understanding of the issues facing society and our customers to contribute to realizing a sustainable society. The company's consolidated revenues for FY2024 were approx. JPY 756.5 billion. For further information, visit https://www.hitachi-hightech.com/global/en/

Business Contact

Michael Molderings
Product Manager, OES
Hitachi High-Tech Analytical Science Ltd.
hha.media@hitachi-hightech.com