Following the huge success of its inaugural edition, the Electronics Asia Conference (EAC), a virtual conference and exhibition organized by AspenCore, the publisher of EE Times Asia, EE Times India, and EDN Asia, is set to take place from October 17 to 19, 2023.
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The inaugural PowerUP Asia, organized by AspenCore, publisher of EETimes Asia, EETimes India, and EDN Asia, opens tomorrow with the latest power electronics topics, including wide-band gap (WBG) devices such as gallium nitride (GaN) and silicon carbide (SiC), power semiconductors, and related technologies, in focus.
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The power electronics landscape is changing. Wide-bandgap (WBG) devices, including gallium nitride (GaN) and silicon carbide (SiC), are gaining traction in replacing silicon devices, which are reaching their theoretical limits in performance, in applications including power modules and power inverters, motor drives, and chargers and adapters, to name a few.
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The growing electric vehicle (EV) industry, increasing calls for renewable energy adoption, the automation trends in the industrial sector, and the rising demand for consumer electronics, are fueling the growth of the power electronics industry as manufacturers set their sights on power efficiency, carbon reduction, and 'greener' energy.
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Recent economic and geopolitical developments, on top of the supply chain shortages and tight inventories in some markets, have driven market watchers to reduce their forecast growth for the semiconductor industry this year.
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The global semiconductor revenue is expected to reach $661 billion in 2022, up by 13.7% year-over-year, according to International Data Corp. (IDC). While industry demand was driven by the industrial and automotive industries in 2021, IDC expects 5G, consumer electronics, wireless technologies, datacenters, and wearables will continue drive demand this year.
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