Sep 22, 2015 09:40 JST

Source: Applied Materials, Inc.

Applied Materials Prices $1.8 Billion of Senior Unsecured Notes

SANTA CLARA, CA, Sep 22, 2015 - (ACN Newswire) - Applied Materials, Inc. (NASDAQ: AMAT) today announced the pricing of senior unsecured notes in an aggregate principal amount of $1.8 billion. The notes consist of the following tranches:

- $600 million of 2.625% senior unsecured notes due 2020
- $700 million of 3.900% senior unsecured notes due 2025
- $500 million of 5.100% senior unsecured notes due 2035

Applied intends to use a portion of the net proceeds of this offering to redeem or repay its outstanding $400 million 2.650% notes due June 15, 2016 and the balance for general corporate purposes. The foregoing does not constitute a notice of redemption or an obligation to issue a notice of redemption for the 2.650% notes.

J.P. Morgan, Citigroup, MUFG and Goldman, Sachs & Co. are acting as joint book-running managers.

The offering was made pursuant to a registration statement on Form S-3 filed with the U.S. Securities and Exchange Commission (SEC) and is expected to close on September 24, 2015, subject to customary closing conditions. The offering of securities is being made only by means of a prospectus supplement and accompanying prospectus, copies of which may be obtained from:

J.P. Morgan Securities LLC
383 Madison Avenue
New York, New York 10179
Attn: High Grade Syndicate
Desk - 3rd Floor
+1-212-834-4533

Citigroup Global Markets Inc.
1155 Long Island Avenue
Edgewood, New York 11717
c/o Broadridge Financial Solutions
+1-800-831-9146

Mitsubishi UFJ Securities (USA), Inc.
1221 Avenue of the Americas, 6th Floor
New York, New York 10020
Attn: Capital Markets Group
+1-212-405-7440

This release does not constitute an offer to sell or the solicitation of an offer to buy securities, nor shall there be any sale of securities in any jurisdiction in which such offer, solicitation or sale would be unlawful prior to registration or qualification under the laws of any such jurisdiction.

Forward-Looking Statements

This release contains forward-looking statements, including those regarding Applied's ability to complete the offering and anticipated use of the proceeds from the offering. These statements and their underlying assumptions are subject to risks and uncertainties and are not guarantees of future performance. Factors that could cause actual results to differ materially from those expressed or implied by such statements include, without limitation: market conditions for corporate debt generally and for our securities; the successful completion of the notes offering; and other risks and uncertainties described in our most recent Form 10-Q and other SEC filings. These and many other factors could cause actual results to differ materially from expectations based on forward-looking statements made in this release or elsewhere by Applied or on its behalf. All forward-looking statements are based on management's estimates, projections and assumptions as of the date hereof, and we assume no obligation to update them.

About Applied Materials

Applied Materials, Inc. (Nasdaq: AMAT) is the global leader in materials engineering solutions for the semiconductor, flat panel display and solar photovoltaic industries. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world.

Contact:
Kevin Winston (editorial/media), +1-408-235-4498, kevin_winston@amat.com
Michael Sullivan (financial community), +1-408-986-7977, michael_sullivan@amat.com

###

This announcement is distributed by NASDAQ OMX Corporate Solutions on behalf of NASDAQ OMX Corporate Solutions clients.
The issuer of this announcement warrants that they are solely responsible for the content, accuracy and originality of the information contained therein.
Source: Applied Materials via Globenewswire

Source: Applied Materials, Inc.


Copyright ©2024 ACN Newswire. All rights reserved. A division of Asia Corporate News Network.


Latest Release

More Latest Release >>