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Hua Hong Semiconductor's 90nm eFlash Process Platform Successfully Achieved Mass Production
HONG KONG, Apr 06, 2016 - (ACN Newswire) - Hua Hong Semiconductor Limited ("Hua Hong Semiconductor" or the "Company", together with its subsidiaries, the "Group"; stock code: 1347.HK), a global leading pure-play 200mm foundry, today announced the successful mass production of its 90nm embedded Flash (eFlash) process platform for fabrication of highly competitive chips featuring small die size, low power and high performance.
The 90nm low-power eFlash process platform developed by Hua Hong Semiconductor is the most advanced 200mm wafer based embedded memory technology in China, which is fully compatible with the standard logic process. While delivering excellent performance and high reliability, it provides extremely compact low-power Flash IPs. Besides, it features a highly integrated library, with a gate density up to 30 percent higher than the 0.11um eFlash process. With these features, the 90nm eFlash process of Hua Hong Semiconductor can achieve more than 30 percent chip size shrinkage compared to that of 0.11um eFlash platform. And even more, coupled with the lower mask cost, 90nm eflash can deliver a technical solution with excellent performance-price ratio for kinds of smart card and security IC products including SIM card, Ukey, SWP, social security card, transport card and MCU.
The embedded non-volatile memory (eNVM) platform is one of the most important strategic processes of the company, which has evolved from the 0.35um, via 0.18um and 0.11um, to the current 90nm node, has always maintained its leadership in the industry. Enabling fabrication of high-quality products, this robust and reliable platform has gained recognition from well-known domestic and oversea fabless design houses. Through continuous R&D efforts, Hua Hong Semiconductor has become a technical leader in smart card IC manufacturing and the largest smart card IC foundry in the world.
"As an expert in the area of eNVM process, Hua Hong Semiconductor is well positioned to deliver superior performance on smaller die size," said Dr. Kong Weiran, Executive Vice President of Hua Hong Semiconductor, "We believe that the successful mass production of the 90nm eFlash process will drive rapid development of new-generation applications. By further shrinking Flash cells, increasing integration of libraries, reducing mask layers, and striving for solutions that enable fabrication of more compact chips at lower cost, Hua Hong Semiconductor will remain the first-choice foundry of eNVM for rapidly growing smart card IC and MCU applications."
Source: Hua Hong Semiconductor
Sectors: Electronics, Daily News
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